SEMICONDUCTOR DEVICE
PURPOSE:To obtain the highly reliable semiconductor device with which a light elimination and a rewriting-in of memory can be performed by a method wherein a light-transmitting member is formed in a tightly fixed manner at the package part located at the upper part of a pellet, and a window is provi...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To obtain the highly reliable semiconductor device with which a light elimination and a rewriting-in of memory can be performed by a method wherein a light-transmitting member is formed in a tightly fixed manner at the package part located at the upper part of a pellet, and a window is provided thereon. CONSTITUTION:A pellet 3 is attached to the bottom part of the cavity 1 of a package substrate 2, and a bonding pad and an inner lead 4 are bonded by a wire 5 for the purpose of obtaining electric conductivity between the pellet 3 and the outside part. A light-irradiating window 7 is formed at the upper part of the pellet 3 by airtightly sealing the cavity 1 on the circumference of the cavity aperture part located at the upper part of the package substrate 2. As said light irradiating window 7 is formed using a transparent alumina sintered plate, it transmits ultraviolet rays sufficiently, and besides, as the window 7 is formed at the upper part of the pellet 3 in the size which sufficiently covers the pellet, the light elimination of memory can be performed without fail. |
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