EVAPORATING SOURCE DEVICE HAVING DIRECTIVITY IN OBLIQUE DIRECTION

PURPOSE:To carry out vapor deposition independently of the placement and shape of a substrate by tilting and rotating a vessel so as to generate vapor distributed at high density in an oblique direction by the evaporation of a material to be evaporated from the evaporating outlet of the vessel tilte...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KOMIYA MUNEHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To carry out vapor deposition independently of the placement and shape of a substrate by tilting and rotating a vessel so as to generate vapor distributed at high density in an oblique direction by the evaporation of a material to be evaporated from the evaporating outlet of the vessel tilted upward. CONSTITUTION:A heat resistant vessel 7 contg. a material 8 to be evaporated is set in a vacuum chamber 1. The vessel 7 is tilted so that the evaporating outlet 4 is titlted upward, and it is made freely rotatable on a tilted rotating shaft 6. The material 8 is melted with electron beams 10 or other heating means 11, and the melt is evaporated from the outlet 4 to generate vapor distributed at high density in an oblique direction. Thus, vapor deposition is carried out independently of the placement and shape of a substrate 3.