RESIST OF THREE-LAYER STRUCTURE AND METHOD FOR ACHIEVING HIGH RESOLUTION PLATE MAKING BY USING IT

PURPOSE:To obtain a resist of 3-layer structure capable of achieving high resolution plate making by laminating on the surface of a base, the first layer of a thin polymer film, the second layer of a thin silicone polymer film, and the third layer of a thin photosensitive polymer film. CONSTITUTION:...

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Bibliographische Detailangaben
1. Verfasser:	HATSUTORI SHIYUUZOU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a resist of 3-layer structure capable of achieving high resolution plate making by laminating on the surface of a base, the first layer of a thin polymer film, the second layer of a thin silicone polymer film, and the third layer of a thin photosensitive polymer film. CONSTITUTION:An objective resist of 3-layer structure is obtained by coating the surface of a base 10 with the first thin polymer film layer 11, plasma treating the surface, bringing a gas contg. silicone vinyl molecules with it, and graft polymerizing it to form the second thin silicone polymer film layer 12, and forming the third thin polymer film layer 13 sensitive to light, X-rays, or electron beams. A high-resolution printing plate is obtained by exposing and developing the third layer of this resist to form a pattern, transferring it to the second layer 12 by the H plasma reactive etching method, and further transferring it to the first layer 11.