AUTOMATIC WAFER PROBER DEVICE
PURPOSE:To enable rapid scanning with a simple construction by driving the titled device so as to take a fixed relative position against a CCD element by a method wherein two CCD elements are arranged, and scribe lines are detected by analyzing wafer image signals by a computer. CONSTITUTION:If the...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To enable rapid scanning with a simple construction by driving the titled device so as to take a fixed relative position against a CCD element by a method wherein two CCD elements are arranged, and scribe lines are detected by analyzing wafer image signals by a computer. CONSTITUTION:If the direction of the scribe line 4 on the wafer is not coincident with the direction of the CCD elements 1 and 2 (of scanning), the superposition of signals by the shift registers 7a and 7b of a cut-out circuit 7 is not carried out, but the signals are inputted from the cut-out circuit to a frequency distribution circuit 8 at high frequency. A microcomputer 9 adjusts the direction of an X-Y-Z-theta stage 11 via stage drive circuit 12 until the frequency of signal output from the cut-out circuit becomes lower as prescribed, thus making the direction of the scribe line on the wafer coincident with the direction of the CCD element. The microcomputer further drives the stage via stage drive circuit in such a manner that each point of intersection of the scribe lines comes to the fixed relative position against the CCD element successively. |
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