PACKAGE FOR CONTAINING SEMICONDUCTOR

PURPOSE:To perform the memory and reproduction of wafer treatment processes by a method wherein a memory sheet and a protection cover are overlapped and provided on the side plate of a carrier for containing wafers, and a contactor in contact with the memory sheet is exposed to a part of the protect...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUGANUMA TATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!