PACKAGE FOR CONTAINING SEMICONDUCTOR

PURPOSE:To perform the memory and reproduction of wafer treatment processes by a method wherein a memory sheet and a protection cover are overlapped and provided on the side plate of a carrier for containing wafers, and a contactor in contact with the memory sheet is exposed to a part of the protection cover. CONSTITUTION:On the side plate 1 of the carrier, the protection cover 6 is superposed on a memory means I made of the nonvolatile memory sheet 5 and a control unit 8, and the contactors 5a...5n are provided at a part of the sheet 5 and then exposed to the cover 6. A display lamp 7 is at the center of the cover 6, guide pins for a recorder and reproducer are inserted in small holes 9 at the upper and lower parts of the side plate 1, thus display 7 is performed by docking each contactor 5a...5n. The carrier I wherein the wafer 3 is contained by this constitution is made to receive and give an apparatus and a signal via the contactors 5a...5n, and the memory content of the sheet 5 is called up, and can be added to the sheet 5, corrected and erased. This carrier enables to detect the wafer treatment processes accurately and rapidly.