ELECTROLESS RUTHENIUM PLATING BATH

PURPOSE:To obtain an electroless Ru plating bath having improved stability, an increased utilization rate of Ru and a dropped operation temp. by blending a nitrosylammine complex salt of Ru with hydrazine and by adjusting the pH. CONSTITUTION:Hydrazine is added to a nitrosylammine complex salt of Ru...

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Bibliographische Detailangaben
Hauptverfasser:	TORIKAI EIICHI, KAWAMI YOUJI, TAKENAKA HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an electroless Ru plating bath having improved stability, an increased utilization rate of Ru and a dropped operation temp. by blending a nitrosylammine complex salt of Ru with hydrazine and by adjusting the pH. CONSTITUTION:Hydrazine is added to a nitrosylammine complex salt of Ru, and the pH is adjusted to 10'13 with an aqueous ammonia soln. or the like to obtain a stable electroless plating bath. A hydroxylamine salt may be added to the bath to improve the stability. The plating bath is used at room temp. - about 60 deg.C. Plating in the plating bath proceeds well until Ru in the soln. is consumed at >=about 90% high rate. The plating bath is applicable to electronic parts made of Cu, Ni, Fe or an alloy thereof, an electrode material, synthetic resin, glass, etc.