PHOTOCURABLE EPOXY RESIN COMPOSITION
PURPOSE:The titled composition excellent in storage stability, noncorrosiveness, and electrical properties, and rapidly curable by irradiation with light, comprising an epoxy compound, an organoaluminum compound, a specified organosilicon compound and an aromatic compound. CONSTITUTION:An epoxy comp...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE:The titled composition excellent in storage stability, noncorrosiveness, and electrical properties, and rapidly curable by irradiation with light, comprising an epoxy compound, an organoaluminum compound, a specified organosilicon compound and an aromatic compound. CONSTITUTION:An epoxy compound having at least one epoxy group in the molecule (e.g., bisphenol A-derived epoxy resin) is mixed with 0.001-5wt% organoaluminum compound (e.g., trimethoxyaluminum), 0.001-10wt% organosilicon compound having a benzyl ether bond or a benzylidene ether bond [e.g., triphenyl(4-methoxybenzyloxy)silane], and 0.001-5wt% aromatic compound containing an alkoxycarbonyl or cyano group (e.g., p-dicyanobenzene). |
---|