JPS5934296B

A resist material used for forming a positive image by application of radiation, said material comprising as principal constituent poly(ethyl alpha -cyanoacrylate), poly(ethyl alpha -amidoacrylate) or a binary copolymer thereof or a ternary copolymer of poly(ethyl alpha -cyanoacrylate), poly(ethyl a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSUCHA SOJI, MATSUDA SHUNSUKE, NAGAMATSU GENTARO, PPONMA MASAMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A resist material used for forming a positive image by application of radiation, said material comprising as principal constituent poly(ethyl alpha -cyanoacrylate), poly(ethyl alpha -amidoacrylate) or a binary copolymer thereof or a ternary copolymer of poly(ethyl alpha -cyanoacrylate), poly(ethyl alpha -amidoacrylate) and polymethacrylonitrile. The minimum incident charge of radiation required for forming a desired resist pattern by use of this resist material is as low as 10-7 coulomb/cm2, or far lower than the level required in use of other known resist materials, and a positive resist image which can well stand the chromium etching solutions is obtained by short-time irradiation.