THERMAL HEAT TO BE CARRIED ON DRIVER

PURPOSE:To facilitate the positioning of connection while improving the yield of forming an IC output line by forming an IC input line employing a multi- layer printed board the same height as the print head section so that the multi- layer printed board and the printing head section are carried on a common substrate adjacent to each other. CONSTITUTION:A equally high print heads 23 and multi-layer printed board 24 are carried on a common substrate 22 to form a thermal head 21 to be carried on a driver on the print head section 23 and the multi-layer printed board 24 crossing over IC25. The print head section 23 has a glaze layer 29 formed on a ceramic substrate 28, a heat generating body element 30 and an electrode 31 thereon and a protective film 32 thereon. The multi-layer printed board 24 is as high as the print head section 23 and formed in layers in the input line of the IC25.