LAMINATED BOARD FOR PRINTED CIRCUIT WITH EPOXY RESIN AS BASE

A laminate based on epoxy resin for printed circuits has epoxy resin-impregnated outer plies, each containing a substrate of glass fibers and epoxy resin-impregnated core plies, each containing a flat textile form or construction made of synthetic thermoplastic fibers.

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Bibliographische Detailangaben
Hauptverfasser:	HERUMUUTO FUASUBENDAA, PAURU SHIYUPIIRAU, RIHIYARUTO BUAISU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A laminate based on epoxy resin for printed circuits has epoxy resin-impregnated outer plies, each containing a substrate of glass fibers and epoxy resin-impregnated core plies, each containing a flat textile form or construction made of synthetic thermoplastic fibers.