TRAPPING APPARATUS

PURPOSE:To trap accurately by providing the first, the second trapping surfaces and a radiant heat preventing means to a trap for treating waste gas from a plasmic treatment apparatus to prevent the surface diffusion of the gas to be treated. CONSTITUTION:The gas to be treated is introduced from a s...

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Bibliographische Detailangaben
1. Verfasser:	OOTSUBO TOORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SEPARATION TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To trap accurately by providing the first, the second trapping surfaces and a radiant heat preventing means to a trap for treating waste gas from a plasmic treatment apparatus to prevent the surface diffusion of the gas to be treated. CONSTITUTION:The gas to be treated is introduced from a suction port 14, and brought into contact with the first trapping surface 13a. Then the treated gas, which is not collected, is a trapped on the second trapping surface 15a. Liquid nitrogen is stored in a vessel 13 as a refrigerant. A shielding plate 16 is provided below the second trapping surface to prevent the incidence of the radiant heat from a trapping apparatus 12 to the second trapping surface.