WIRE BONDING DEVICE

PURPOSE:To feed out twin wires smoothly in a guide by intermittently converting optical paths of a laser and removing an excessive resin adhering on a separated wire in a bonding device consisting of a feed-mechanism for the twin wires, a wire split pushing and separating the resin mutually coupling the twin wires and a laser light source attaching the separated wire to a printed substrate under a melted state. CONSTITUTION:The outer circumferences of a signal wire 2 and a ground wire 3 are each coated with urethane resin 1, and these wires are arranged in two rows and coupled by a nylon filler 4, thus manufacturing twin wires 5. When the wires 5 are forwarded to a bonding pad 19, a pin 15 is pushed against the wires 5 before a guide 16 and the wires 5 are divided into wires 2 and 3, but optical paths of laser beams fed to a laser corn 17 are converted by using reflecting mirrors 21 and 22 at that time. That is, the reflecting mirror 21 is inverted, laser beams are propagated straightly during bonding, the optical paths are changed when the wires are fed out, and the excessive filler 4 is burnt down.