POSITIVE TYPE PHOTORESIST COMPOSITION

PURPOSE:To obtain a positive type photoresist improved in adhesion and high in resolution by adding a specified substance in a photoresist compsn. CONSTITUTION:Adhesion is remarkably improved by adding an unsatd. polyester to a positive type photoresist compsn. contg. a phenoxy-diazide compd. as a p...

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Bibliographische Detailangaben
Hauptverfasser:	YASUI MASAAKI, HANABATAKE MAKOTO, FURUTA AKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a positive type photoresist improved in adhesion and high in resolution by adding a specified substance in a photoresist compsn. CONSTITUTION:Adhesion is remarkably improved by adding an unsatd. polyester to a positive type photoresist compsn. contg. a phenoxy-diazide compd. as a photosensitive agent. Said unsatd. polyester is one being liquid at normal temp. obtainable by polycondensing unsatd. dicarboxylic acid with glycol. A good result is obtained when said polyester is added to the positive type photoresist compsn. in an amt. of 1-30wt% of the total wt. of a photosensitive component, an alkali-soluble component, and additive components, if any. This photoresist compsn. can be used for LSI having an about 1mum sized pattern by virtue of its high resolution and excellent adhesion to the substrate.