HIGH CURRENT DENSITY PLATING METHOD OF METALLIC STRIP
PURPOSE:To provide the current density much higher than in the prior art by ejecting directly an electrolyte toward a metallic strip from slit nozzles, feeding the electrolyte in such a way that insoluble electrodes and the strip facing the same immersed in the electrolyte and plating the strip at t...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To provide the current density much higher than in the prior art by ejecting directly an electrolyte toward a metallic strip from slit nozzles, feeding the electrolyte in such a way that insoluble electrodes and the strip facing the same immersed in the electrolyte and plating the strip at the high current density. CONSTITUTION:A metallic strip 4 which travels in an electrolyte is guided by a turn roll 5A, is directionally changed by a roll 9 attached with cathodes for the purpose of plating and is guided by a turn roll 5B. Plural pieces of plate-shaped insoluble electrodes 12 provided perpendicular to the traveling direction of the strip 4 are electrified to the positive polarity and an electrolyte is fed from slit nozzles 16 disposed between the electrodes 12 so that the plating metal is deposited on the strip 4. The rate of the ejection thereof is adjusted to the rate at which the electrodes 12 and the strip 4 are fully immersed in the electrolyte. The strip is thus plated at high current density. |
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