MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To perform bonding operation using a safe jig easy to be replaced by a method wherein a heater block heating lead frame is provided with a bonding jig with a recession. CONSTITUTION:A heat conductive bonding jig 5 is provided with a central recession. The recession suffices to contain an isl...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAWASE KATSUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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