MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To perform bonding operation using a safe jig easy to be replaced by a method wherein a heater block heating lead frame is provided with a bonding jig with a recession. CONSTITUTION:A heat conductive bonding jig 5 is provided with a central recession. The recession suffices to contain an isl...

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Bibliographische Detailangaben
1. Verfasser:	KAWASE KATSUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE:To perform bonding operation using a safe jig easy to be replaced by a method wherein a heater block heating lead frame is provided with a bonding jig with a recession. CONSTITUTION:A heat conductive bonding jig 5 is provided with a central recession. The recession suffices to contain an island 2 of lead frame while a lead 4 supporting the bottom of island 2 and the island itself is provided just to come into contact with the bonding jig 5. The bonding jig 5 available in various shapes may be adapted to any shape of lead frame. The jig is vavorable for safety remarkably reducing the time of replacement since a heater 8 need not be replaced in case of using a lead frame with different shape.