REPEELABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRODUCTION THEREOF

PURPOSE:To obtain a pressure-sensitive adhesive which makes it possible to repeat a bonding-peeling cycle comprising bonding it to an adherend and then peeling it off therefrom, by suspension-polymerizing an alkyl (meth)acrylate and an alpha-monoolefincarboxylic acid in an aq. medium and then polyme...

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Bibliographische Detailangaben
1. Verfasser:	KINOSHITA TOORU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a pressure-sensitive adhesive which makes it possible to repeat a bonding-peeling cycle comprising bonding it to an adherend and then peeling it off therefrom, by suspension-polymerizing an alkyl (meth)acrylate and an alpha-monoolefincarboxylic acid in an aq. medium and then polymerizing a vinyl monomer in the presence of the resulting suspension-polymn. mixture. CONSTITUTION:100pts.wt. monomer component consisting of 70-99.9wt% C4- C12 alkyl (meth)acrylate (a), 0.1-10wt% alpha-monoolefincarboxylic acid (b) and 0- 29.9wt% other vinyl monomer (c) is suspension-polymerized in an aq. medium to obtain bondable fine polymer particles having an average particle size of 10- 100mu. 20-300pts.wt. vinyl monomer is polymerized in the presence of the resulting aq. suspension to produce polymer particles having an average particle size of 0.1-4mu.