COPPER ALLOY FOR LEAD FRAME

PURPOSE:To obtain a Cu alloy for a lead frame for IC with superior workability in manufacture as well as strength, electric conductivity, heat resisntance and assembling workability which are comparable to those of phosphor bronze by adding specified amounts of Sn and Zr to Cu. CONSTITUTION:This Cu...

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Bibliographische Detailangaben
Hauptverfasser:	SANKI SADAHIKO, MIYAKE YASUHIKO, TAMURA KOUICHI, WATANABE KIKUO, KONISHI KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a Cu alloy for a lead frame for IC with superior workability in manufacture as well as strength, electric conductivity, heat resisntance and assembling workability which are comparable to those of phosphor bronze by adding specified amounts of Sn and Zr to Cu. CONSTITUTION:This Cu alloy for a lead frame for IC consists of, by weight, 1.5-5.0% Sn, 0.05-0.5% Zr and the balance Cu. The alloy may further contain about 0.05-0.5% rare earth element and/or about 0.03-0.20% P. The alloy is melted by high-frequency heating in the air, and it is hot-rolled to a plate of about 7mm. thickness at about 800-850 deg.C. After cleaning the surfaces by pickling, the plate is repeatedly subjected to cold rolling and annealing to obtain a thin plate of about 0.25mm. thickness. About 85% high draft can be attained in the cold rolling stages except the final finish rolling stage.