WAFER CLEANING APPARATUS

PURPOSE:To obtain a maintenance-free wafer cleaning apparatus by eliminating a vacuum sealing means. CONSTITUTION:A rotating shaft 13 is coupled with an exhausting path 12 and has a clearance 17 which allows rotation of the rotating shaft whisle a chuck 11 is fixing wafers and is inserted into a spinner case 15 so that it can rotate through a bearing 18. Simultaneously, said rotating shaft 13 is coupled with a driving motor 16 through a coupling 19. Wafers are rotated by driving a driving motor 16 and rotating the chuck 11 through the coupling 19 and the rotating shaft 13. In this case, since any vacuum sealing means is not provided between the rotating shaft 3 and a bush 14, leak occurs at the bearing 18, but this leak is suppressed to such a degree that the chuck 11 can be rotated under the condition that the wafers are fixed in accordance with the clearance 17.