MOLDED PIECE

PURPOSE:To prepare an insert molded piece that is suitable for container covers etc. and can be obtained inexpensively by using configuration memory properties of configuration memory alloy by integrally molding synthetic resin and configuration memory alloy in which a configuration is stored and pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIRANO MASAO, TAKAOKA MOTOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING GRANULES OR PREFORMS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To prepare an insert molded piece that is suitable for container covers etc. and can be obtained inexpensively by using configuration memory properties of configuration memory alloy by integrally molding synthetic resin and configuration memory alloy in which a configuration is stored and processed in advance. CONSTITUTION:A configuration memory alloy piece 23 in which a desired configuration is stored and processed in advance is tightened in the form of C-ring so that the outer circumference of an insert part body 21 with a screw hole 22 etc. is covered. This insert part is inserted into a mold, synthetic resin 24 is poured into the mold and the insert part and synthetic resin 24 are molded integrally. In this manner, the configuration memory metal piece 23 takes heat from the mold when it is of thermosetting resin and when it is of thermoplastic resin the piece deforms into a stored configuration 23 according to the temperature of the injected resin and is molded integrally with the resin 24 to obtain the desired molded piece.