DRY ETCHING DEVICE

PURPOSE:To improve the uniformity of etching, and to enhance the yield of products by installing a rotary blade under the state opposite to the etching surface of a material to be etched in a parallel plate type and installing it to an upper section in a reaction pipe in a cylinder type. CONSTITUTION:In the parallel plate type dry etching device, an upper electrode 2 and an opposite electrode 3 mutually arranged in parallel are encased in a chamber 1. The materials to be etched 4 such as masks or wafers are fitted to the upper electrode 2 through holders. The rotary blade 5 is set up to the upper section of the opposite electrode 3, and turned at low speed during etching. An etching gas introduced from a gas blowoff port 6 diffuses in the chamber 1 kept at the fixed degree of vacuum, is agitated properly by the rotary blade 5, and is discharged from an exhaust port 7 after a reaction. In the cylinder type dry etching device, the two small-sized rotary blades 13 are installed to an upper section in a cylindrical chamber 11 with high-frequency electrodes 12 on the outside, and an etching gas flowing into the chamber 11 from a gas blow-off port 16 is agitated properly.