CROSSLINKED POLYAMIDE RESIN COMPOSITION

PURPOSE:To obtain titled composition free from glass fiber but infusible even in a bath of molten solder, thus useful for formed items and heat-resistant electric wire covering materials, by carrying out a crosslinking, using a radiation, of a crosslinking auxiliary-incorporated polyamide resin. CON...

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Bibliographische Detailangaben
Hauptverfasser:	UDA IKUJIROU, UENO KEIJI, INUI TOSHIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain titled composition free from glass fiber but infusible even in a bath of molten solder, thus useful for formed items and heat-resistant electric wire covering materials, by carrying out a crosslinking, using a radiation, of a crosslinking auxiliary-incorporated polyamide resin. CONSTITUTION:The objective composition can be obtained by exposing a radiation (pref. an electron beam) to a polyamide resin (e.g., nylon-12) incomporated with a crosslinking auxiliary such as triallyl (iso)cyanurate to effect crosslinking. The above polyamide resin way further be incorporated with a flame-retardant, filler, etc.