PHOTOPOLYMERIZABLE RESIN COMPOSITION

PURPOSE:To improve the adhesive strength of a photopolymerizable resin composition to a metallic surface by adding a very small amount of a specified compound to the composition which is used to form a photoresist for a printed wiring board. CONSTITUTION:This photopolymerizable resin composition con...

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Hauptverfasser:	NAKAUCHI JIYUN, UCHIDA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To improve the adhesive strength of a photopolymerizable resin composition to a metallic surface by adding a very small amount of a specified compound to the composition which is used to form a photoresist for a printed wiring board. CONSTITUTION:This photopolymerizable resin composition consists of a thermoplastic polymer for a binder, a cross-linkable monomer having an ethylenic unsatd. group in the molecule, a photopolymn. initiator, and lophin. Lophin is a very effective component for improving the adhesive strength of a photoresist to a metallic plate. The amount of the compound contained in the composition depends on the components of the photoresist, the ratio among the components and the hardness of the photoresist after photosetting, and the preferred amount is 0.001-1wt% so as to produce a significant adhesive effect. More than the upper limit of the compound reduces the sensitivity, and less than the lower limit of the compound is liable to cause throwing during solder plating.