SEMICONDUCTOR DEVICE

PURPOSE:To improve reliability, to make it possible to obtain high density, and to simplify packaging work, by performing the face down bonding of a plurality of chips on a silicon substrate, fixing the silicon substrate in a ceramic base, thereby preventing the breakdown of bumps and the like accompanied by temperature change. CONSTITUTION:A plurality of silicon chips 12... are fixed to a wiring 11 on the surface of a silicon substrate 10 through bumps 13 of the chips by a face down bonding method. The silicon substrate 10, to which the chips 12 are fixed, is fixed to the inner bottom surface of a cavity 15a of a ceramic base 15 by a brazing material 14 comprising Ag paste, glass having relatively high melting point, or the like. Each chip 12 is directly fixed to the silicon substrate 10, which has the same material as that of the chip. Therefore, stress is not caused by heat, and the connection breakdown of the bumps 13 does not occur. Even through a plurality of the chips 12 are mounted in the same package through one sheet of the silicon substrate 10, the reliability of the chip connection can be maintained at a sufficiently high level.