MANUFACTURE OF SEMICONDUCTOR CHIP

PURPOSE:To prevent contamination on the surface of a chip by a method wherein, utilizing the self-adhering property of a self-adhered layer, a semiconductor wafer is temporarily adhered on the self-adhering layer, and after it has been cut into chips of desired size, the adhered layer is soaked in a solvent, and the chips are exfoliated by moistening the adhered layer, thereby enabling to remove the contamination of the solvent. CONSTITUTION:Plasticizer of 1-60pts.wt. is mixed in graft polymer of 100pts.wt. wherein vinyl chloride monomer is graft-polymerized into an ethylene-vinyl acetate copolymer, other auxiliary agent is added if necessary, and a self-adhering film having self-adhering property is formed. Then, said self-adhering film is adhered on a soft vinyl chloride resin film, and a semiconductor wafer is temporarily adhered thereon. Subsequently, the wafer is directly cut or a groove is provided by performing a scribing, the wafer is independently formed into pellets by folding it at the groove, the film is soaked in the solvent such as methyl-ethyl ketone, tetrahydrofuran and the like, and the pellets are separated into pieces by swelling the self-adhering layer.