PREPARATION OF FILM METALLIZED WITH COPPER

PURPOSE:To prepare easily a film metallized with copper for flexible printed substrate having improved adhesivity between a plastic and a deposited copper layer, by metallizing the surface of a heat-resistant plastic film with copper in vacuum, heat-treating it at a specific temperature. CONSTITUTIO...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUNAGA SATORU, ICHII TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To prepare easily a film metallized with copper for flexible printed substrate having improved adhesivity between a plastic and a deposited copper layer, by metallizing the surface of a heat-resistant plastic film with copper in vacuum, heat-treating it at a specific temperature. CONSTITUTION:(A) The surface of a heat-resistant plastic film (e.g., polyethylene terephthalate film) is metallized with (B) copper in a vacuum, and heat-treated at 110-200 deg.C, preferably at 120-130 deg.C for 10-30min, at 130-140 deg.C for 5- 20min, or at 140-150 deg.C for 3-10min, to give a film metallized with copper.