SEMICONDUCTOR DEVICE
PURPOSE:To manufacture the semiconductor device of high part mounting-density by forming an electronic circuit to a substrate with a recessed section, on which a semiconductor element is loaded, and a cap formed so as to seal the recessed section of the substrate. CONSTITUTION:Resistor paste is prin...
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| creator | MURAKAMI SHIYUUICHI SAEKI KEIJI KUDOU SHINICHI |
| description | PURPOSE:To manufacture the semiconductor device of high part mounting-density by forming an electronic circuit to a substrate with a recessed section, on which a semiconductor element is loaded, and a cap formed so as to seal the recessed section of the substrate. CONSTITUTION:Resistor paste is printed on the alumina multilayer substrate 1 with an external conductor 2 connected to an internal conductor 3 by pin holes 4 and the recessed section 6, on which the semiconductor element 8 is loaded, through screen printing, dried and baked, and resistors 5 are formed. The semiconductor element 8 is bonded with a gold pad 7, and wire-bonded by gold wires 9 in 30mum. The cap 10 for airtight sealing with an Ag-Pd conductor 11 formed by printing Ag-Pd paste on the alumina substrate, drying the paste and baking it is bonded with the alumina multilayer substrate 1 by low melting-point glass 12, and sealed in an airtight manner. A chip capacitor 13 is fitted in order to connect the conductor 11 of the cap 10 and the external conductor 2 of the alumina multilayer substrate 1, and bonded with solder 14. |
| format | Patent |
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CONSTITUTION:Resistor paste is printed on the alumina multilayer substrate 1 with an external conductor 2 connected to an internal conductor 3 by pin holes 4 and the recessed section 6, on which the semiconductor element 8 is loaded, through screen printing, dried and baked, and resistors 5 are formed. The semiconductor element 8 is bonded with a gold pad 7, and wire-bonded by gold wires 9 in 30mum. The cap 10 for airtight sealing with an Ag-Pd conductor 11 formed by printing Ag-Pd paste on the alumina substrate, drying the paste and baking it is bonded with the alumina multilayer substrate 1 by low melting-point glass 12, and sealed in an airtight manner. A chip capacitor 13 is fitted in order to connect the conductor 11 of the cap 10 and the external conductor 2 of the alumina multilayer substrate 1, and bonded with solder 14.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1984</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19840627&DB=EPODOC&CC=JP&NR=S59111350A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19840627&DB=EPODOC&CC=JP&NR=S59111350A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MURAKAMI SHIYUUICHI</creatorcontrib><creatorcontrib>SAEKI KEIJI</creatorcontrib><creatorcontrib>KUDOU SHINICHI</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>PURPOSE:To manufacture the semiconductor device of high part mounting-density by forming an electronic circuit to a substrate with a recessed section, on which a semiconductor element is loaded, and a cap formed so as to seal the recessed section of the substrate. 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A chip capacitor 13 is fitted in order to connect the conductor 11 of the cap 10 and the external conductor 2 of the alumina multilayer substrate 1, and bonded with solder 14.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1984</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcGmloaGhsamBo7GxKgBAInWHvQ</recordid><startdate>19840627</startdate><enddate>19840627</enddate><creator>MURAKAMI SHIYUUICHI</creator><creator>SAEKI KEIJI</creator><creator>KUDOU SHINICHI</creator><scope>EVB</scope></search><sort><creationdate>19840627</creationdate><title>SEMICONDUCTOR DEVICE</title><author>MURAKAMI SHIYUUICHI ; SAEKI KEIJI ; KUDOU SHINICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS59111350A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1984</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MURAKAMI SHIYUUICHI</creatorcontrib><creatorcontrib>SAEKI KEIJI</creatorcontrib><creatorcontrib>KUDOU SHINICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MURAKAMI SHIYUUICHI</au><au>SAEKI KEIJI</au><au>KUDOU SHINICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>1984-06-27</date><risdate>1984</risdate><abstract>PURPOSE:To manufacture the semiconductor device of high part mounting-density by forming an electronic circuit to a substrate with a recessed section, on which a semiconductor element is loaded, and a cap formed so as to seal the recessed section of the substrate. CONSTITUTION:Resistor paste is printed on the alumina multilayer substrate 1 with an external conductor 2 connected to an internal conductor 3 by pin holes 4 and the recessed section 6, on which the semiconductor element 8 is loaded, through screen printing, dried and baked, and resistors 5 are formed. The semiconductor element 8 is bonded with a gold pad 7, and wire-bonded by gold wires 9 in 30mum. The cap 10 for airtight sealing with an Ag-Pd conductor 11 formed by printing Ag-Pd paste on the alumina substrate, drying the paste and baking it is bonded with the alumina multilayer substrate 1 by low melting-point glass 12, and sealed in an airtight manner. A chip capacitor 13 is fitted in order to connect the conductor 11 of the cap 10 and the external conductor 2 of the alumina multilayer substrate 1, and bonded with solder 14.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE |
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