SEMICONDUCTOR DEVICE

PURPOSE:To manufacture the semiconductor device of high part mounting-density by forming an electronic circuit to a substrate with a recessed section, on which a semiconductor element is loaded, and a cap formed so as to seal the recessed section of the substrate. CONSTITUTION:Resistor paste is printed on the alumina multilayer substrate 1 with an external conductor 2 connected to an internal conductor 3 by pin holes 4 and the recessed section 6, on which the semiconductor element 8 is loaded, through screen printing, dried and baked, and resistors 5 are formed. The semiconductor element 8 is bonded with a gold pad 7, and wire-bonded by gold wires 9 in 30mum. The cap 10 for airtight sealing with an Ag-Pd conductor 11 formed by printing Ag-Pd paste on the alumina substrate, drying the paste and baking it is bonded with the alumina multilayer substrate 1 by low melting-point glass 12, and sealed in an airtight manner. A chip capacitor 13 is fitted in order to connect the conductor 11 of the cap 10 and the external conductor 2 of the alumina multilayer substrate 1, and bonded with solder 14.