MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To allow a cutting process for a wiring in a short time and a clean manner without the necessity of large current conduction into another element and of providing a pad for cutting by a method wherein, via an insulation film coating the wiring, a part of the metal or alloy thereof is sublima...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SATOU NORIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES
Online-Zugang:	Volltext bestellen
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