SUBMOUNT FOR FITTING LASER DIODE CHIP

SUBMOUNT FOR FITTING LASER DIODE CHIP

PURPOSE:To furnish a submount for fitting a laser diode chip which enbles the reduction of the number of work processes. CONSTITUTION:A submount 3 is formed of a silicon plate 7, and a chip connection member 15 is provided on the surface of the low ground part 13 thereof, while an insulator 16 and a...

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Hauptverfasser: MEGURO MASAO, MINOWA NORIHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MEGURO MASAO
MINOWA NORIHIRO
description PURPOSE:To furnish a submount for fitting a laser diode chip which enbles the reduction of the number of work processes. CONSTITUTION:A submount 3 is formed of a silicon plate 7, and a chip connection member 15 is provided on the surface of the low ground part 13 thereof, while an insulator 16 and a wire connection member 17 are provided on the surface of the high ground part 14 thereof. The assembly on the submount having such a constitution is performed by the following work processes: fitting a chip 5 to the chip connection member 15 of the submount 3 (1); mounting the submount 3 on a stem 1 (2); connecting a wire 11 between an electrode on the chip 5 and the wire connection member 17 (3); connecting a wire 12 between the wire connection member 17 and a lead for inspection not shown in the figure (4); conducting the specific estimation of the chip by impression of a voltage between the stem 1 and the lead for inspection (5); disconnecting the wire 12 connected to the lead for inspection (6); and exfoliating the submount 3 from the stem 1 (7).
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CONSTITUTION:A submount 3 is formed of a silicon plate 7, and a chip connection member 15 is provided on the surface of the low ground part 13 thereof, while an insulator 16 and a wire connection member 17 are provided on the surface of the high ground part 14 thereof. The assembly on the submount having such a constitution is performed by the following work processes: fitting a chip 5 to the chip connection member 15 of the submount 3 (1); mounting the submount 3 on a stem 1 (2); connecting a wire 11 between an electrode on the chip 5 and the wire connection member 17 (3); connecting a wire 12 between the wire connection member 17 and a lead for inspection not shown in the figure (4); conducting the specific estimation of the chip by impression of a voltage between the stem 1 and the lead for inspection (5); disconnecting the wire 12 connected to the lead for inspection (6); and exfoliating the submount 3 from the stem 1 (7).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19830525&amp;DB=EPODOC&amp;CC=JP&amp;NR=S5887892A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19830525&amp;DB=EPODOC&amp;CC=JP&amp;NR=S5887892A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MEGURO MASAO</creatorcontrib><creatorcontrib>MINOWA NORIHIRO</creatorcontrib><title>SUBMOUNT FOR FITTING LASER DIODE CHIP</title><description>PURPOSE:To furnish a submount for fitting a laser diode chip which enbles the reduction of the number of work processes. 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The assembly on the submount having such a constitution is performed by the following work processes: fitting a chip 5 to the chip connection member 15 of the submount 3 (1); mounting the submount 3 on a stem 1 (2); connecting a wire 11 between an electrode on the chip 5 and the wire connection member 17 (3); connecting a wire 12 between the wire connection member 17 and a lead for inspection not shown in the figure (4); conducting the specific estimation of the chip by impression of a voltage between the stem 1 and the lead for inspection (5); disconnecting the wire 12 connected to the lead for inspection (6); and exfoliating the submount 3 from the stem 1 (7).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1983</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFANDnXy9Q_1C1Fw8w9ScPMMCfH0c1fwcQx2DVJw8fR3cVVw9vAM4GFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BwaYWFuYWlkaOxkQoAQBhcSM5</recordid><startdate>19830525</startdate><enddate>19830525</enddate><creator>MEGURO MASAO</creator><creator>MINOWA NORIHIRO</creator><scope>EVB</scope></search><sort><creationdate>19830525</creationdate><title>SUBMOUNT FOR FITTING LASER DIODE CHIP</title><author>MEGURO MASAO ; MINOWA NORIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS5887892A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1983</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MEGURO MASAO</creatorcontrib><creatorcontrib>MINOWA NORIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MEGURO MASAO</au><au>MINOWA NORIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBMOUNT FOR FITTING LASER DIODE CHIP</title><date>1983-05-25</date><risdate>1983</risdate><abstract>PURPOSE:To furnish a submount for fitting a laser diode chip which enbles the reduction of the number of work processes. CONSTITUTION:A submount 3 is formed of a silicon plate 7, and a chip connection member 15 is provided on the surface of the low ground part 13 thereof, while an insulator 16 and a wire connection member 17 are provided on the surface of the high ground part 14 thereof. The assembly on the submount having such a constitution is performed by the following work processes: fitting a chip 5 to the chip connection member 15 of the submount 3 (1); mounting the submount 3 on a stem 1 (2); connecting a wire 11 between an electrode on the chip 5 and the wire connection member 17 (3); connecting a wire 12 between the wire connection member 17 and a lead for inspection not shown in the figure (4); conducting the specific estimation of the chip by impression of a voltage between the stem 1 and the lead for inspection (5); disconnecting the wire 12 connected to the lead for inspection (6); and exfoliating the submount 3 from the stem 1 (7).</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBMOUNT FOR FITTING LASER DIODE CHIP
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