SUBMOUNT FOR FITTING LASER DIODE CHIP

PURPOSE:To furnish a submount for fitting a laser diode chip which enbles the reduction of the number of work processes. CONSTITUTION:A submount 3 is formed of a silicon plate 7, and a chip connection member 15 is provided on the surface of the low ground part 13 thereof, while an insulator 16 and a wire connection member 17 are provided on the surface of the high ground part 14 thereof. The assembly on the submount having such a constitution is performed by the following work processes: fitting a chip 5 to the chip connection member 15 of the submount 3 (1); mounting the submount 3 on a stem 1 (2); connecting a wire 11 between an electrode on the chip 5 and the wire connection member 17 (3); connecting a wire 12 between the wire connection member 17 and a lead for inspection not shown in the figure (4); conducting the specific estimation of the chip by impression of a voltage between the stem 1 and the lead for inspection (5); disconnecting the wire 12 connected to the lead for inspection (6); and exfoliating the submount 3 from the stem 1 (7).