WAFER LOADING DEVICE

PURPOSE:To prevent damages on the wafer surface when holding and carrying a wafer by a claw, by allowing only the repulsive force of a spring to absorb the fluctuation of binding forces loaded on the wafer side surface by the dimensional error in the range of tolerance for manufacturing a wafer. CONSTITUTION:A rolling body 8 mounted at one end of a reciprocating shaft 3b is pressed on the side surface of a rotary cam 1b. At the other end of the reciprocating shaft 3b, a claw 5b wherein the angle of the wafer 7 holding point forms an acute angle to the vertical direction is mounted for loading and unloading. Thus, since the fixed relief space DELTAS is provided in the deepest part or shallowest part, the contact between the rolling body 8 mounted at one end of the reciprocating shaft 3b and the side wall surface of a guide groove 2b is broken, then the wafer 7 is held only by the repulsive force of the spring 9, and accordingly the damage of thin film on the wafer 7 surface can be prevented.