ELECTRICALLY-CONDUCTIVE RESIN COMPOSITION

PURPOSE:A composition capable of being electroplated directly, having improved adhesivity of electroplating, not causing dispersion of adhesivity and embossing, obtained by blending a polyolefin resin with carbon black, sulfur, and a specific diamine compound. CONSTITUTION:100pts.wt. polyolefin is b...

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Bibliographische Detailangaben
Hauptverfasser: MAKI MASAMI, IMAI MASAO, KAWAI YOUICHI, SEKIGUCHI KATSUMI, SASAGAWA KATSUYOSHI, YOKOTE YUKIO, GOTOU YOSHIHISA
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:A composition capable of being electroplated directly, having improved adhesivity of electroplating, not causing dispersion of adhesivity and embossing, obtained by blending a polyolefin resin with carbon black, sulfur, and a specific diamine compound. CONSTITUTION:100pts.wt. polyolefin is blended with 10-60pts.wt. carbon black, 0.1-6pts.wt. sulfur, and at least 0.1pt.wt. commpound shown by the formulaI [A is a group shown by the formula II (m is 1-9), a group shown by the formula III (n is 1-5), a group shown by the formula IV (B is H, methyl, chlorine, bromine, or nitro; p is 1-4), or a group shown by the formula V (X is oxygen, sulfur, methylene, imino, or sulfuryl)]or its metal salt. Ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic aicd or their metal salts are preferable as the compound shown by the formulaI.