THIN FILM MULTI-LAYER WIRING CIRCUIT FOR THERMAL HEAD

PURPOSE:To raise the yield of manufacturing a multi-layer wiring circuit by a method in which in making a block division sequential driving method, the number of scanning signal lines is divided into blocks, and each block divided is orderly driven in the order of each block. CONSTITUTION:A practical example of (128 lines)X(2 division)X(8 blocks) is given in Fig. Signal terminal 42 is divided into 128 lines Si-Sn and S'1-S'n (n=128) for left and right sides, heating elements of 128 dots are housed in one block of common terminal 41, and the block number becomes terminal 41, and the block number becomes 8-block terminals. In short, 128 lines of a matrix multi-layer wiring circuit 43 is made up, having a region in which image elements (128mm.) of half B4-size can be treated by the signal line of 128 lines. The region l1 where the wiring of the second layer is formed in this case becomes 1/2 of the conventional ratio, in case where it has the same dimension as in the conventional method, and also the occupying area of the region at which the first and second wiring lines are crossed becomes 1/2 of the conventional ratio.