CONVEYING METHOD FOR SEMICONDUCTOR WAFER

PURPOSE:To simplify the control of processing using a computer by a method wherein the perforations indicating a lot number are provided on a card which was formed in the same size and shape of a semiconductor wafer, said card is considered to be as the component of a sheet of semiconductor wafer and it is inserted at both ends of the semiconductor wafer group arranged on a carrier. CONSTITUTION:A card 7 is a disc of almost the same shape as the semiconductor wafer, it can be placed in a carriers as one sheet component of the semiconductor wafer, perforations are provided in single row or a plurality of rows on the card, types of work, lot numbers, conditions of processing and the like are indicated by holes 7a, 7a'..., 7b, 7c and so on, a starting dot for reading, the central indication of the punched hole groups and the like are indicated by said holes. A perforation process is performed in each step and process of work, and the read information is inputted to the central processing unit. Various processing steps A1...AN, and B1...BN are performed successively, or performed in an overlapping manner such as A1 B1 C1 A1, or performed in an jumping manner such as A1 C1. Before starting the desired process, the principal items of the process which is going to be performed are perforations using sensors 1, 2 and the like, they are read and sent to CPU for storing.