VAPOR DEPOSITING DEVICE

PURPOSE:To perform mixed vapor deposition at a uniform mixing ratio by disposing plural vapor sources which contain vapor depositing materials of mutually different evaporating temps. with the vapor source of the higher temp. on the upper side and the vapor source of the lower temp. on the lower side, and releasing the vapor depositing materials through a common opening provided above these sources. CONSTITUTION:A high temp. vapor source 1 contg. a vapor depositing material H of a high evaporating temp. is disposed on the upper side near an object to be vapor-deposited and a low temp. vapor source 2 contg. a vapor depositing material L of a lower evaporating temp. on the lower side. The source 1 and the source 2 have resistance heating elements 4', 4 respectively as heating sources. Thereupon, the materials H, L are evaporated respectively separately from both sources 1, 2 and the vapors of both vapor depositing materials are released through the common opening 7 provided above these sources and is deposited on the object to be vapor-deposited. It is equally well to provide openings to both sources respectively, and to cross both vapor depositing materials just on the surface of the object to be vapor-deposited or just before the same by providing the openings in proximity to each other.