HYBRID THIN FILM INTEGRATED HEAD

PURPOSE:To reduce the induction of external noises, by forming a magneto- resistance (MR) head part on which an MR element and an electrode part are formed by thin film depositing method and a semiconductor integrated circuit chip on which a magnetic signal detecting circuit is formed on the same substrate and connecting both the electrodes by a wire bonding method. CONSTITUTION:The substrate 4 is formed by glass, quartz, alumina, ferrite, or the like, the MR head part 5 obtained by forming the MR element 2 and a conductive part 3 to be used as an electrode on a silicon substrate by a thin film depositing lating method is fixed on the substrate 4 and the magnetic recording medium side of the MR head part 5 is covered and protected with an inuslating substrate 5a formed by glass, quartz, or the like. The semiconductor integrated circuit chip 7 consisting of a magnetic signal detecting circuit and a preamplifier is also fixed on the substrate 4. The pad part 8 of the semiconductor integrated circuit chip 7 is electrically connected with the conductive part 3 of the MR head part 5 through a thin wire 9 by a wire bonding method or the like.