BURN-IN APPARATUS OF SEMICONDUCTOR DEVICE

PURPOSE:To efficiently realize burn-in of many semiconductor device using a small size thermostatic oven by stacking a plurality of semiconductor devices and loading them to a single socket. CONSTITUTION:Since burn-in is carried out by loading a semiconductor device accommodating case 10 wherein a plurality of DIL type semiconductor devices 2 are loaded to a single case loading socket 16, burn-in of many semiconductor devices 2 can be realized by using a smaller thermostatic oven than that used for loading a single semiconductor device 2 to a single socket. Moreover, in case of loading a plurality of semiconductor devices within the accommodating case 10, space between the side plates 12a, 12b in both longitudinal sides is a little widened by loosening fitting bolts 13 and then they are tightened after inserting these semiconductor devices. In case of taking out semiconductor devices 2 from the accommodating case 10, space between the side plates 12a, 12b in both longitudinal sides is a little widened by loosening the fitting bolts 13 and the connecting terminals 15a, 15b of the accommodating case 10 are place upward. Thereby, semiconductor devices 2 can be taken out very easily with good working efficiency.