EPOXY RESIN COMPOSITION

EPOXY RESIN COMPOSITION

PURPOSE:An epoxy resin composition having high storage stability and being curable within a short time, containing an epoxy resin and a specified imidazole compound as a curing catalyst. CONSTITUTION:A composition containing an epoxy compound containing an epoxy group in the molecule and a compound...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HAYASE SHIYUUJI, OONISHI KIYONOBU
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HAYASE SHIYUUJI
OONISHI KIYONOBU
description PURPOSE:An epoxy resin composition having high storage stability and being curable within a short time, containing an epoxy resin and a specified imidazole compound as a curing catalyst. CONSTITUTION:A composition containing an epoxy compound containing an epoxy group in the molecule and a compound of formula I , wherein M is Si or Sn; R1, R2, R3 and R4 are each H, a 1-5C alkyl, or an aromatic group; n is 0-3; when there are a plurality of R4's, they can be the same or different, and when there are a plurity of imidazolyl groups, they can be the same or different. Imidazol compounds which can be used especially suitably include compounds of formulas II and III, etc. The amount of the imidazole compound added is preferably 0.1-10pts.wt. An amount of below 0.1pt.wt. is not sufficient to cure the resin, whereas when it is above 10pts.wt., the cured product obtained does not have sufficient electrical properties.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS58194918A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS58194918A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS58194918A3</originalsourceid><addsrcrecordid>eNrjZBB3DfCPiFQIcg329FNw9vcN8A_2DPH09-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcGmFoaWJpaGFo7GxKgBAPfbIBo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EPOXY RESIN COMPOSITION</title><source>esp@cenet</source><creator>HAYASE SHIYUUJI ; OONISHI KIYONOBU</creator><creatorcontrib>HAYASE SHIYUUJI ; OONISHI KIYONOBU</creatorcontrib><description>PURPOSE:An epoxy resin composition having high storage stability and being curable within a short time, containing an epoxy resin and a specified imidazole compound as a curing catalyst. CONSTITUTION:A composition containing an epoxy compound containing an epoxy group in the molecule and a compound of formula I , wherein M is Si or Sn; R1, R2, R3 and R4 are each H, a 1-5C alkyl, or an aromatic group; n is 0-3; when there are a plurality of R4's, they can be the same or different, and when there are a plurity of imidazolyl groups, they can be the same or different. Imidazol compounds which can be used especially suitably include compounds of formulas II and III, etc. The amount of the imidazole compound added is preferably 0.1-10pts.wt. An amount of below 0.1pt.wt. is not sufficient to cure the resin, whereas when it is above 10pts.wt., the cured product obtained does not have sufficient electrical properties.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19831114&amp;DB=EPODOC&amp;CC=JP&amp;NR=S58194918A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19831114&amp;DB=EPODOC&amp;CC=JP&amp;NR=S58194918A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAYASE SHIYUUJI</creatorcontrib><creatorcontrib>OONISHI KIYONOBU</creatorcontrib><title>EPOXY RESIN COMPOSITION</title><description>PURPOSE:An epoxy resin composition having high storage stability and being curable within a short time, containing an epoxy resin and a specified imidazole compound as a curing catalyst. CONSTITUTION:A composition containing an epoxy compound containing an epoxy group in the molecule and a compound of formula I , wherein M is Si or Sn; R1, R2, R3 and R4 are each H, a 1-5C alkyl, or an aromatic group; n is 0-3; when there are a plurality of R4's, they can be the same or different, and when there are a plurity of imidazolyl groups, they can be the same or different. Imidazol compounds which can be used especially suitably include compounds of formulas II and III, etc. The amount of the imidazole compound added is preferably 0.1-10pts.wt. An amount of below 0.1pt.wt. is not sufficient to cure the resin, whereas when it is above 10pts.wt., the cured product obtained does not have sufficient electrical properties.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1983</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB3DfCPiFQIcg329FNw9vcN8A_2DPH09-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcGmFoaWJpaGFo7GxKgBAPfbIBo</recordid><startdate>19831114</startdate><enddate>19831114</enddate><creator>HAYASE SHIYUUJI</creator><creator>OONISHI KIYONOBU</creator><scope>EVB</scope></search><sort><creationdate>19831114</creationdate><title>EPOXY RESIN COMPOSITION</title><author>HAYASE SHIYUUJI ; OONISHI KIYONOBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS58194918A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1983</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HAYASE SHIYUUJI</creatorcontrib><creatorcontrib>OONISHI KIYONOBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAYASE SHIYUUJI</au><au>OONISHI KIYONOBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY RESIN COMPOSITION</title><date>1983-11-14</date><risdate>1983</risdate><abstract>PURPOSE:An epoxy resin composition having high storage stability and being curable within a short time, containing an epoxy resin and a specified imidazole compound as a curing catalyst. CONSTITUTION:A composition containing an epoxy compound containing an epoxy group in the molecule and a compound of formula I , wherein M is Si or Sn; R1, R2, R3 and R4 are each H, a 1-5C alkyl, or an aromatic group; n is 0-3; when there are a plurality of R4's, they can be the same or different, and when there are a plurity of imidazolyl groups, they can be the same or different. Imidazol compounds which can be used especially suitably include compounds of formulas II and III, etc. The amount of the imidazole compound added is preferably 0.1-10pts.wt. An amount of below 0.1pt.wt. is not sufficient to cure the resin, whereas when it is above 10pts.wt., the cured product obtained does not have sufficient electrical properties.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPS58194918A
source esp@cenet
subjects CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title EPOXY RESIN COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T13%3A45%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HAYASE%20SHIYUUJI&rft.date=1983-11-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS58194918A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true