EPOXY RESIN COMPOSITION

PURPOSE:An epoxy resin composition having high storage stability and being curable within a short time, containing an epoxy resin and a specified imidazole compound as a curing catalyst. CONSTITUTION:A composition containing an epoxy compound containing an epoxy group in the molecule and a compound of formula I , wherein M is Si or Sn; R1, R2, R3 and R4 are each H, a 1-5C alkyl, or an aromatic group; n is 0-3; when there are a plurality of R4's, they can be the same or different, and when there are a plurity of imidazolyl groups, they can be the same or different. Imidazol compounds which can be used especially suitably include compounds of formulas II and III, etc. The amount of the imidazole compound added is preferably 0.1-10pts.wt. An amount of below 0.1pt.wt. is not sufficient to cure the resin, whereas when it is above 10pts.wt., the cured product obtained does not have sufficient electrical properties.