HYBRID INTERGRATED CIRCUIT DEVICE

PURPOSE:To contrive to form the hybrid integrated circuit device in a small type by a method wherein a connecting segment part having narrower width as compared with surface width of a plate type outside lead out terminal is formed while being bent and extended in one body to the tip part of the terminal thereof. CONSTITUTION:A part of a thermally radiating block 1 is formed protruding in a terminal type to form a plate type outside lead out terminal 2. The connecting segment parts 8', 9' formed in one body to the tip parts of the other plate type lead out terminals 8, 9 are equipped integrating in one body to the conductive parts 5 of a ceramic substrate 4. Because the parts 8', 9' are bendingly formed from the tip parts of the terminals 8, 9, the parts 8', 9' come in contact the parts 5 by the faces always. Surface width (b) of the parts 8', 9' is formed narrower as compared with surface width (a) of the terminals 8, 9. When the intrval between the mutual parts 5 is narrower than the interval between the mutual terminals 8, 9 according to formation of the device in the small type, or even when the arranging position of the parts 5 and the arranging position of the terminals 8, 9 are shifted, equipment can be attained naturally, and no hindrance is generated to the flow of a current.