MANUFACTURE OF POWER INTEGRATED CIRCUIT

PURPOSE:To develop and mass-produce a power IC chip having various outputs in a short period by arranging a plurality of power IC chips with power transistors of small outputs in response to outputs and wiring wires among these chips. CONSTITUTION:Wiring is formed to a peripheral circuit section shaped to each chip through normal photolithography technique by using a wiring mask for 2W prepared. When the power ICs at 4W are wired, four unit chips are arranged, and the power transistors 22 of each chip are wired by using a wiring mask so as to be made to reach 4W outputs. The power ICs are wired through a master slice method. That is, the small output power IC chips used as units are manufactured in a bulk process, and the power ICs are wired through normal technique in order of the formation of an electrode window, the formation of a metal material for wiring, the formation of a window for wiring, the formation of a protective film, the formation of a window for a pad section, etc. by using masks prepared in response to outputs in the next wiring process.