PHENOLIC RESIN MOLDING MATERIAL

PHENOLIC RESIN MOLDING MATERIAL

PURPOSE:To prepare the titled molding material having improved burr releasability and cylinder stability without lowering the gloss of the molded product, by adding powder of low molecular weight polyethylene to kneaded and pulverized phenolic resin molding material. CONSTITUTION:A phenolic resin is...

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Hauptverfasser: FUKUSHI HIDEMI, OOYAMA HISAO
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator FUKUSHI HIDEMI
OOYAMA HISAO
description PURPOSE:To prepare the titled molding material having improved burr releasability and cylinder stability without lowering the gloss of the molded product, by adding powder of low molecular weight polyethylene to kneaded and pulverized phenolic resin molding material. CONSTITUTION:A phenolic resin is added with a curing agent, etc. necessary for molding material, and kneaded and pulverized. The pulverized material is added with 0.01-0.5wt% low molecular weight polyethylene powder preferably having an average molecular weight of
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CONSTITUTION:A phenolic resin is added with a curing agent, etc. necessary for molding material, and kneaded and pulverized. 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CONSTITUTION:A phenolic resin is added with a curing agent, etc. necessary for molding material, and kneaded and pulverized. 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CONSTITUTION:A phenolic resin is added with a curing agent, etc. necessary for molding material, and kneaded and pulverized. The pulverized material is added with 0.01-0.5wt% low molecular weight polyethylene powder preferably having an average molecular weight of &lt;=5,000 and a particle diameter of finer than 16 mesh.</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title PHENOLIC RESIN MOLDING MATERIAL
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