PHENOLIC RESIN MOLDING MATERIAL

PURPOSE:To prepare the titled molding material having improved burr releasability and cylinder stability without lowering the gloss of the molded product, by adding powder of low molecular weight polyethylene to kneaded and pulverized phenolic resin molding material. CONSTITUTION:A phenolic resin is...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUKUSHI HIDEMI, OOYAMA HISAO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To prepare the titled molding material having improved burr releasability and cylinder stability without lowering the gloss of the molded product, by adding powder of low molecular weight polyethylene to kneaded and pulverized phenolic resin molding material. CONSTITUTION:A phenolic resin is added with a curing agent, etc. necessary for molding material, and kneaded and pulverized. The pulverized material is added with 0.01-0.5wt% low molecular weight polyethylene powder preferably having an average molecular weight of