RESIN SEALING OF SEMICONDUCTOR INTEGRATED CIRCUIT AND LEAD FRAME USED FOR THE SAME

PURPOSE:To realize automatic manufacturing processes and extend life time of facilities by perfectly preventing formation of plastic burrs. CONSTITUTION:An important part including semiconductor element, internal lead and connecting wire are molded. As the lower die and upper die for molding, conventional ones are used. At this time, the mold region is very closer to a second tie bar. A tab lead is cut at the boundary of tab lead and mold, and a first tie bar is removed by cutting the junction part of the first tie bar 22 and lead 23 with a blade. A fine junction area between the second tie bar 24 and lead 23 can also be broken and removed simultaneously by cutting and removing the first tie bar 22. Therefore, the second tie bar 24 can be easily removed and thereby generation of plastic burrs can be prevented perfectly. After these processes, the leads leaving in the outside of mold are bent in the same direction and thereby a dual inline type semiconductor device can be completed.