SOLIDSTATE IMAGE PICKUP DEVICE

PURPOSE:To obtain a highly reliable solidstate image device by interposing a heat insulating member between the opening end of a package and the transparent glass plate of a cap. CONSTITUTION:Between a transparent glass plate 7 which constitutes a cap to be seam-welded to the opening end of a package 1, and a platelike metallic frame body 8, a ceramic frame body 12 as a heat insulating member is arranged under adhesion thus constituting the cap 3 by the glass plate 7, frame body 12, and a frame body 8. In this case, the frame body 12 is welded on the side of a glass plate 7 by using an Ag solder rod. The frame body 8 of the cap 13 is seam-welded to the upper stage part 10 of the package 1 by interposing an Au/ Sn solder material 11. Thus, the frame body 12 is interposed between the glass plate 7 and metallic body 8 to absorb the heat, generated during the welding between the cap 13 and the upper stage part of the package, by the frame body 12, so that the glass plate 7 has no residual thermal strain left.