SEMICONDUCTOR ELEMENT AND MANUFACTURE THEREOF

PURPOSE:To simplify manufacturing processes and prevent contamination in manufacture, by collectively performing the connection of each element to wirings for external lead-out formed on a lid simultaneously performing the seal of each element, while the elements are under wafer state. CONSTITUTION:A lid 12 is superposed on a wafer 11 so that each lid 2 corresponds to each element. Thereat, each pad 5 on each lid 2 contacts the bonding bad 4 on each element respectively corresponded, and a thermal adhesive insulator 3 on the fringe contacts the fringe of the main surface of each element. Therefore, said pad 5 with thermal adhesiveness adheres to the bonding pad 4 resulting in the electrical connection of said bonding pad 4 and the wiring 6 of the lid 2 by next heating this wafer 11 and lid 12. Simultaneously, outer sealing can be performed by the thermal adhesive insulator.