SEMICONDUCTOR SEALING AND MOLDING RESIN COMPOSITION MATERIAL

PURPOSE:To easily obtain high moisture proof resin sealed body at low cost by making a mold resin contain glass flakes. CONSTITUTION:Glass flakes of 30wt% is mixed to the cresol novolak type epoxy resin of 100wt%, fenol novolak of 50wt%, carbon black 2wt%, amorphous silica powder of 320wt%, silane c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MATSUMURA MASAHIRO, KUNITOMI TETSUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To easily obtain high moisture proof resin sealed body at low cost by making a mold resin contain glass flakes. CONSTITUTION:Glass flakes of 30wt% is mixed to the cresol novolak type epoxy resin of 100wt%, fenol novolak of 50wt%, carbon black 2wt%, amorphous silica powder of 320wt%, silane coupling agent of 2wt%, 2-methylimidasol of 1wt% and carnauba wax of 2wt% and such mixed compound is knead at 90-100 deg.C. Then, it is cooled and crashed and thereby a composition for semiconductor element sealing and molding can be obtained. When a semiconductor is sealed by such composition material, penetration of moisture from outside can be rejected by the glass flakes, reliability of element can be improved and simple and economical sealing can be realized.