PRETREATMENT OF SEMICONDUCTOR CRYSTAL

PURPOSE:To prevent the formation of pit and nonuniform etching of the surface of a GaSb substrate in the treatment of the substrate with a Br2-methanol etching liquid, by pretreating the substrate with concentrated sulfuric acid and dilute nitric acid. CONSTITUTION:For example, in the etching of a m...

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Hauptverfasser: KISHI YUTAKA, OKAZAKI JIROU
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To prevent the formation of pit and nonuniform etching of the surface of a GaSb substrate in the treatment of the substrate with a Br2-methanol etching liquid, by pretreating the substrate with concentrated sulfuric acid and dilute nitric acid. CONSTITUTION:For example, in the etching of a mirror polished undoped (001) GaSb substrate, the substrate is degreased by ultrasonic radiation in trichlene, and immersed in concentrated sulfuric acid for about 2min. Then the substrate is washed thoroughly with water, immersed in a dilute nitric acid composed of 1pt. of nitric acid and 2pts. of water for about 1min to remove the oxide layer, and again washed with water for about 3-5sec to prevent the reoxidation of the surface. Thereafter, the substrate is etched with a Br2-methanol etching liquid. A mirror etching free from pit and nonuniform etching can be achieved by this pretreatment.